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Daikin Malaysia Group Scholarship Program for Malaysian Students in Malaysia, 2018

Applications are welcomed for Daikin Malaysia Group Scholarship Program for the Year2018 Malaysian students are qualified to use for this scholarship.

DaikinMalaysiaSdn Bhd. (DAMA) is the only cooling producer in Malaysia producing a large range of HVAC devices for the Malaysian and international export markets from fundamental domestic air-conditioners to high innovation light business and business heatpump, air-cooled and water-cooled chillers?

The combination with Daikin has actually made it possible for Daikin Malaysia to profit from each other’s strengths and compensate for each other’s weak points in addition to establish organisation and enhance innovation.

ScholarshipDescription:

  • Engineering(ideally in Electrical & Electronics, Mechanical, Mechatronic, Manufacturing)
  • IT
  • Accounting
  • Business/Management
  • Eligibilityfor the Scholarship:

    EligibleCountries: Malaysian students are qualified to use for this scholarship.

    EntranceRequirements: Applicants should fulfill the following requirements:

    Scholars(students) Eligibility:

  • Malaysian
  • Full- time trainee
  • The trainee pursuing a Bachelor’s Degree
  • Already got approval into Malaysia Universities (IPTA/IPTS). Preference will be offered to students from IPTA.
  • Possess excellent scholastic outcome:
  • Students who will register into 1st-year-degree program
  • Students presently pursuing 1st-year-degree program
  • Actively got involved in co-curriculum activities and showed exceptional management qualities.
  • Strong interactions abilities.
  • Possess a favorable mindset.
  • Medically fit.
  • Have not got other financial assistance from any company.
  • Scholars who are devoid of any future work commitments.
  • Students who fulfill the above requirements (a to k) are welcome to use. However, choice will be offered to students from households with family earnings of RM5,00 0 monthly or listed below.
  • EnglishLanguage Requirements: Applicants should have strong interactions abilities.

    ApplicationProcedure:

    How to Apply:

  • Application type can be downloaded from the site
  • Applicants should send their application all files connected in PDF format.
  • Applications are open for submission now and close on 31 st August 2018.
  • For any additional queries, please contactMs Kay Lee Yen Hui (603-61458632) orMr Chan Foo Keat (603-61458633)
  • The total application will be sent out by post.
  • ScholarshipLink

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