Bachelor’s Scholarship Program for Malaysian Students, 2017

Applications are being accepted for Daikin Malaysia Group ScholarshipProgram Scholarships are offered for pursuing bachelor’s degree program.

CourseLevel: Scholarships are offered for pursuing bachelor’s degree program.

StudySubject: Scholarships are granted in the field of Engineering (ideally in Electrical & Electronics, Mechanical, Mechatronic, Manufacturing), IT, Accounting, Business/Management and Sciences.

Scholarship can be taken in Malaysia

Eligibility:

  • Malaysian
  • Full- time trainee
  • Student pursuing a Bachelor’s Degree
  • Already got approval into Malaysia Universities (IPTA/IPTS). Preference will be provided to students from IPTA.
  • Possess excellent scholastic outcome:
  • Students who will enlist into 1st year degree program
    – SPM or equivalent– minutes 6As + pass all topics. Good leads to Mathematics, English, and Bahasa Malaysia.
    – STPM or equivalent– minutes 2As + pass all topics.
    – MUET– minutes Band 4.
  • Students presently pursuing 1st year degree program

– SPM or equivalent– minutes 6As + pass all topics. Good leads to Mathematics, English, and Bahasa Malaysia.

– STPM or equivalent– minutes 2As + pass all topics.

– MUET– minutes Band 4.

-Min GPA or CGPA 3.00

  • Actively took part in co-curriculum activities and showed exceptional management qualities
  • Strong interactions abilities
  • Possess favorable mindset
  • Medically fit
  • Have not got other financial assistance from any company
  • Scholars who are devoid of any future work commitments
  • Students who fulfill the above requirements (a to k) are welcome to use. However, choice will be provided to students from households with home earnings of RM5,000 each month or listed below.

Nationality: Malaysian students are qualified to use.

CollegeAdmission Requirement

EntranceRequirement:Applicants should have previous degree.

How to Apply: Applicants should send their application to daikin.scholarship- at-daikin. com.my with all files connected in PDF format.

ApplicationForm

ApplicationDeadline: The application due date is September 30, 2017.

ScholarshipLink

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